Circuit board -01
Number: 14371809
Classification: Circuit board
Characteristic: It has good heat conduction and heat dissipation effects, and is widely used in hybrid integrated modules, network resistors, focusing potentiometers, semiconductor coolers, power modules, ozone generating films, etc.
Area: Civil machine and some military fields
Consult nowProduct Features
1 Overview
Ceramic metallization is one of the newly developed technical fields in recent years. It has independent intellectual property rights and has obvious innovation in metallization formula, powder sorting and ball milling technology, coating and infrared drying technology. At the domestic leading level.
2, detailed parameters
The surface of the ceramic material is metallized to make it a composite material with both ceramic properties and metallic properties.
3. Application fields
Widely used in electronic components, substrates. Various ceramic metallization processes such as silver metal method, molybdenum manganese metal method, and active metallization are available.
- Prve：Circuit board -02
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