Black ceramics with low melting point which used for glass substrate integrated circuit, is one of the main forms of integrated circuit package (full ceramic package, black ceramics low melting glass packaging, plastic packaging). The reliability and production cost are between all ceramic and plastic packaging. It's has the characteristics of good light shielding performance, good protection for photo sensitive semiconductor device, good heat dissipation. The thin film substrate used for integrated circuit, with accurate size, fine surface condition, good eletrical performance which was widely used in civil and military fields.